Process capability2018-08-29T09:53:49+00:00
Description Technology
Surface treatment HASL, Lead Free HASL,,Gold plating, Immersion silver, OSP
Minimum line spacing 4/4mil(0.1/0.1mm)
Minimum line width 4mil
Lower aperture 0.25mm
Finished Board Thickness 0.2mm ~ 7.0mm(8mil-276mil)
Plate thickness 0.4-3.2mm
Max gold plating thickness 50 microinch
Max.Finshed Size 600mm x 900mm (23.6″ x 35.43″)
Special Holes Blind/Buried holes, Countersunk holes
Reference Standard IPC-A-600H Class 2, Class 3, TS16949
Copper thick 0.5oz-6oz
Application Electronics Device
Material FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium
Number of Layers: Customized, UP TO 12L
Solder mask color
Testing 100% E-Testing
Capacity PTH:±0.076mm(+/-3mil), NTPH:±0.05mm(+/-2mil)
Packing type Vacuum & Carton
Certificates UL, ISO9001, ROHS, SGS
Inpendence control tolerance +/-10%
Service One-stop Service,OEM/ODM
PCB Assembly process SMT THT DIP
Laminate FR-4,Halogen free,High TG etc