Project Description

Brand Name JIUDU
Model Number Customized
Place of Origin: China Jiangsu
Surface treatment HASL, Lead Free HASL,,Gold plating, Immersion silver, OSP
Minimum line spacing 4/4mil(0.1/0.1mm)
Minimum line width 4mil
Lower aperture 0.25mm
Plate thickness 0.4-3.2mm
Copper thick 0.5oz-6oz
Application Electronics Device
Material FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium
Number of Layers: Customized, UP TO 12L
PCB Assembly Min. IC Pitch 0.30mm(12mil)
PCB Assembly Foot Pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
PCB Assembly Min. Chip Placement 1005
PCB Assembly Max. PCB Size 410mm x 600mm(16.2″ x 23.6″)
PCB Assembly Min. PCB Thickness 0.35mm(13.8mil)
PCB Assembly Maximum BGA Size 74mm x 74mm(2.9 x 2.9)
PCB Assembly BGA Ball Pitch 1mm ~ 3mm(4mil ~ 12mil)
PCB Assembly BGA Ball Diameter 0.4mm ~ 1mm(16mil ~ 40mil)
PCB Assembly QFP Lead Pitch 0.38mm ~ 2.54mm(15mil ~ 100mil)
PCB Assembly Package Anti-static Bubble Bag & Carton