PCBA-01

//PCBA-01
PCBA-012018-09-10T03:33:34+00:00

Project Description

表面处理 HASL, Lead Free HASL,,Gold plating, Immersion silver, OSP
最小线距 4/4mil(0.1/0.1mm)
最小线宽 4mil
最小孔径 0.25mm
板厚 0.4-3.2mm
原产地 China Jiangsu
铜厚 0.5oz-6oz
用途 电子设备
材质 FR4, High Tg FR4, Halogen Free, Isola, Rogers, Aluminium
层数 Customized, UP TO 12L
PCB Assembly Min. IC Pitch 0.30mm(12mil)
PCB Assembly Foot Pin SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
PCB Assembly Min. Chip Placement 01005
PCB Assembly Max. PCB Size 410mm x 600mm(16.2″ x 23.6″)
PCB Assembly Min. PCB Thickness 0.35mm(13.8mil)
PCB Assembly Maximum BGA Size 74mm x 74mm(2.9 x 2.9)
PCB Assembly BGA Ball Pitch 1mm ~ 3mm(4mil ~ 12mil)
PCB Assembly BGA Ball Diameter 0.4mm ~ 1mm(16mil ~ 40mil)
PCB Assembly QFP Lead Pitch 0.38mm ~ 2.54mm(15mil ~ 100mil)
PCB Assembly Package Anti-static Bubble Bag & Carton